NEW YORK, Aug. 17, 2023 /PRNewswire/ — The semiconductor packaging materials market is expected to grow by USD 10,158.72 million from 2022 to 2027, according to Technavio. As per the latest report, the market will progress at a CAGR of 6.06% during the forecast period. The increase in the adoption of semiconductor ICs for automobiles and the shift toward copper as bonding wire material is an emerging market trend. The rising need for semiconductor wafers is due to the automation and electrification of automobiles. Anti-lock braking systems, car navigation, airbag control, GPS, and display, power doors and windows, collision detection technology, infotainment, and automated driving are some of the major benefits. Hence, such factors drive the growth of the market during the forecast period. View a Sample Report within minutes!
Semiconductor Packaging Materials Market 2023-2027: Scope
Technavio presents a detailed picture of the market by way of study, synthesis, and summation of data from multiple sources. Our semiconductor packaging materials market report covers the following areas:
Semiconductor Packaging Materials Market sizeSemiconductor Packaging Materials Market trendsSemiconductor Packaging Materials Market industry analysisSemiconductor Packaging Materials Market five forces analysisSemiconductor Packaging Materials Market competitive landscapeSemiconductor Packaging Materials Market 2023-2027 : SegmentationSemiconductor Packaging Materials Market is segmented as below:
Material Organic SubstratesLead FramesBonding WiresCeramic PackagesOthersEnd-user Consumer ElectronicsAutomotiveMedical DevicesCommunication And TelecomOthersGeography APACNorth AmericaEuropeSouth AmericaMiddle East And AfricaThe organic substrates segment will be significant during the forecast period. The rising demand is since these materials are used these materials are base layers of individual semiconductor devices and ICs on which other layers are deposited to complete the circuit. Such materials are a part of the circuit, and it is important that these are efficient conductors of electricity and thinner core materials. Hence, such factors boost the segment growth during the forecast period.
To learn more about the global trends impacting the future of market research, download a sample report!
Semiconductor Packaging Materials Market 2023-2027: Market Dynamics
The rise in global demand for consumers drives market growth. The market growth can be attributed to factors such as the rise in the sales of smart devices such as smartwatches, smartphones, and smart bands globally. Resultantly, it has fuelled the growth of semiconductor packaging materials. Some of the key applications of IC and semiconductors include Tablets and smartphones. Hence, such factors boost the market growth of the semiconductor packaging materials market during the forecast period.
Regulations associated with semiconductor packaging materials challenge market growth. Complying with strict material specifications set down by packaging assemblers and testers is a major challenge. Packaging chemical and materials suppliers are facing increased environmental regulations, especially in developing countries because there is a growing concern for environmental hazards related to packaging. Hence, such challenges impede the market growth during the forecast period.
What’s New? –
Special coverage on the Russia-Ukraine war; global inflation; recovery analysis from COVID-19; supply chain disruptions, global trade tensions; and risk of recessionGlobal competitiveness and key competitor positionsMarket presence across multiple geographical footprints – Strong/Active/Niche/Trivial – Buy the report!Semiconductor Packaging Materials Market 2023-2027: Company Analysis
We provide a detailed analysis of around 25 companies operating in the Semiconductor Packaging Materials Market, including some of the companies such as Amkor Technology Inc., ASE Technology Holding Co. Ltd., BASF SE, ChipMOS TECHNOLOGIES INC., DuPont de Nemours Inc., Henkel AG and Co. KGaA, Heraeus Holding GmbH, Hitachi Ltd., Honeywell International Inc., Indium Corp., Intel Corp., KYOCERA Corp., LG Innotek Co. Ltd., MITSUI and CO. LTD., Nan Ya Printed Circuit Board Corp., Nippon Steel Corp., Powertech Technology Inc., Samsung Electronics Co. Ltd., Taiwan SEMICONDUCTOR CO. LTD, and Texas Instruments Inc. Backed with competitive intelligence and benchmarking, our research reports on the Semiconductor Packaging Materials Market are designed to provide entry support, customer profile, and M&As as well as go-to-market strategy support.
Company Offerings
Amkor Technology Inc. – The company offers semiconductor packaging materials such as copper leadframe substrates.ASE Technology Holding Co. Ltd. – The company offers semiconductor packaging materials such as flip-chip chip scale package substrate.BASF SE – The company offers semiconductor packaging materials such as Ultrapure electronic materials.Semiconductor Packaging Materials Market 2023-2027: Key Highlights
CAGR of the market during the forecast period 2023-2027Detailed information on factors that will assist semiconductor packaging materials market growth during the next five yearsEstimation of the semiconductor packaging materials market size and its contribution to the parent marketPredictions on upcoming trends and changes in consumer behaviorThe growth of the semiconductor packaging materials marketAnalysis of the market’s competitive landscape and detailed information on vendorsComprehensive details of factors that will challenge the growth of semiconductor packaging materials market vendorsGain instant access to 17,000+ market research reports.Technavio’s SUBSCRIPTION platform
Related Reports:The secondary packaging market size is estimated to grow at a CAGR of 4.04% between 2022 and 2027. The market size is forecast to increase by USD 72.19 billion. This secondary packaging market report extensively covers market segmentation by type (paper and plastic), application (food, beverages, pharmaceuticals, personal and home care, and others), and geography (North America, Europe, APAC, South America, and Middle East and Africa). The increasing demand for processed and packaged foods is notably driving the market growth.
The Mexico packaging market size is estimated to grow at a CAGR of 3.51% between 2022 and 2027. The market size is forecast to increase by USD 2,333.59 million. This Mexico packaging market report extensively covers market segmentation by end-user (food, beverage, healthcare, personal care, and others), and type (board, rigid plastic, flexible, metal, and glass). The growing consumer demand for packaged food products is driving growth in the Mexico packaging market.
Semiconductor Packaging Materials Market Scope
Report Coverage
Details
Base year
2022
Historic period
2017-2021
Forecast period
2023-2027
Growth momentum & CAGR
Accelerate at a CAGR of 6.06%
Market growth 2023-2027
USD 10,158.72 million
Market structure
Fragmented
YoY growth 2022- 2023 (%)
4.52
Regional analysis
APAC, North America, Europe, South America, and Middle East and Africa
Performing market contribution
APAC at 70%
Key countries
US, China, Taiwan, Japan, and South Korea
Competitive landscape
Leading Vendors, Market Positioning of Vendors, Competitive Strategies, and Industry Risks
Key companies profiled
Amkor Technology Inc., ASE Technology Holding Co. Ltd., BASF SE, ChipMOS TECHNOLOGIES INC., DuPont de Nemours Inc., Henkel AG and Co. KGaA, Heraeus Holding GmbH, Hitachi Ltd., Honeywell International Inc., Indium Corp., Intel Corp., KYOCERA Corp., LG Innotek Co. Ltd., MITSUI and CO. LTD., Nan Ya Printed Circuit Board Corp., Nippon Steel Corp., Powertech Technology Inc., Samsung Electronics Co. Ltd., Taiwan SEMICONDUCTOR CO. LTD, and Texas Instruments Inc.
Market dynamics
Parent market analysis, Market growth inducers and obstacles, Fast-growing and slow-growing segment analysis, COVID-19 impact and recovery analysis and future consumer dynamics, Market condition analysis for forecast period.
Customization purview
If our report has not included the data that you are looking for, you can reach out to our analysts and get segments customized.
Table Of Contents :
1 Executive Summary
1.1 Market overviewExhibit 01: Executive Summary – Chart on Market OverviewExhibit 02: Executive Summary – Data Table on Market OverviewExhibit 03: Executive Summary – Chart on Global Market CharacteristicsExhibit 04: Executive Summary – Chart on Market by GeographyExhibit 05: Executive Summary – Chart on Market Segmentation by MaterialExhibit 06: Executive Summary – Chart on Market Segmentation by End-userExhibit 07: Executive Summary – Chart on Incremental GrowthExhibit 08: Executive Summary – Data Table on Incremental GrowthExhibit 09: Executive Summary – Chart on Vendor Market Positioning2 Market Landscape
2.1 Market ecosystemExhibit 10: Parent marketExhibit 11: Market Characteristics3 Market Sizing
3.1 Market definitionExhibit 12: Offerings of vendors included in the market definition3.2 Market segment analysisExhibit 13: Market segments3.3 Market size 20223.4 Market outlook: Forecast for 2022-2027Exhibit 14: Chart on Global – Market size and forecast 2022-2027 (USD million)Exhibit 15: Data Table on Global – Market size and forecast 2022-2027 (USD million)Exhibit 16: Chart on Global Market: Year-over-year growth 2022-2027 (%)Exhibit 17: Data Table on Global Market: Year-over-year growth 2022-2027 (%)4 Historic Market Size
4.1 Global semiconductor packaging materials market 2017 – 2021Exhibit 18: Historic Market Size – Data Table on global semiconductor packaging materials market 2017 – 2021 (USD million)4.2 Material Segment Analysis 2017 – 2021Exhibit 19: Historic Market Size – Material Segment 2017 – 2021 (USD million)4.3 End-user Segment Analysis 2017 – 2021Exhibit 20: Historic Market Size – End-user Segment 2017 – 2021 (USD million)4.4 Geography Segment Analysis 2017 – 2021Exhibit 21: Historic Market Size – Geography Segment 2017 – 2021 (USD million)4.5 Country Segment Analysis 2017 – 2021Exhibit 22: Historic Market Size – Country Segment 2017 – 2021 (USD million)5 Five Forces Analysis
5.1 Five forces summaryExhibit 23: Five forces analysis – Comparison between 2022 and 20275.2 Bargaining power of buyersExhibit 24: Chart on Bargaining power of buyers – Impact of key factors 2022 and 20275.3 Bargaining power of suppliersExhibit 25: Bargaining power of suppliers – Impact of key factors in 2022 and 20275.4 Threat of new entrantsExhibit 26: Threat of new entrants – Impact of key factors in 2022 and 20275.5 Threat of substitutesExhibit 27: Threat of substitutes – Impact of key factors in 2022 and 20275.6 Threat of rivalryExhibit 28: Threat of rivalry – Impact of key factors in 2022 and 20275.7 Market conditionExhibit 29: Chart on Market condition – Five forces 2022 and 20276 Market Segmentation by Material
6.1 Market segmentsExhibit 30: Chart on Material – Market share 2022-2027 (%)Exhibit 31: Data Table on Material – Market share 2022-2027 (%)6.2 Comparison by MaterialExhibit 32: Chart on Comparison by MaterialExhibit 33: Data Table on Comparison by Material6.3 Organic substrates – Market size and forecast 2022-2027Exhibit 34: Chart on Organic substrates – Market size and forecast 2022-2027 (USD million)Exhibit 35: Data Table on Organic substrates – Market size and forecast 2022-2027 (USD million)Exhibit 36: Chart on Organic substrates – Year-over-year growth 2022-2027 (%)Exhibit 37: Data Table on Organic substrates – Year-over-year growth 2022-2027 (%)6.4 Lead frames – Market size and forecast 2022-2027Exhibit 38: Chart on Lead frames – Market size and forecast 2022-2027 (USD million)Exhibit 39: Data Table on Lead frames – Market size and forecast 2022-2027 (USD million)Exhibit 40: Chart on Lead frames – Year-over-year growth 2022-2027 (%)Exhibit 41: Data Table on Lead frames – Year-over-year growth 2022-2027 (%)6.5 Bonding wires – Market size and forecast 2022-2027Exhibit 42: Chart on Bonding wires – Market size and forecast 2022-2027 (USD million)Exhibit 43: Data Table on Bonding wires – Market size and forecast 2022-2027 (USD million)Exhibit 44: Chart on Bonding wires – Year-over-year growth 2022-2027 (%)Exhibit 45: Data Table on Bonding wires – Year-over-year growth 2022-2027 (%)6.6 Ceramic packages – Market size and forecast 2022-2027Exhibit 46: Chart on Ceramic packages – Market size and forecast 2022-2027 (USD million)Exhibit 47: Data Table on Ceramic packages – Market size and forecast 2022-2027 (USD million)Exhibit 48: Chart on Ceramic packages – Year-over-year growth 2022-2027 (%)Exhibit 49: Data Table on Ceramic packages – Year-over-year growth 2022-2027 (%)6.7 Others – Market size and forecast 2022-2027Exhibit 50: Chart on Others – Market size and forecast 2022-2027 (USD million)Exhibit 51: Data Table on Others – Market size and forecast 2022-2027 (USD million)Exhibit 52: Chart on Others – Year-over-year growth 2022-2027 (%)Exhibit 53: Data Table on Others – Year-over-year growth 2022-2027 (%)6.8 Market opportunity by MaterialExhibit 54: Market opportunity by Material (USD million)Exhibit 55: Data Table on Market opportunity by Material (USD million)7 Market Segmentation by End-user
7.1 Market segmentsExhibit 56: Chart on End-user – Market share 2022-2027 (%)Exhibit 57: Data Table on End-user – Market share 2022-2027 (%)7.2 Comparison by End-userExhibit 58: Chart on Comparison by End-userExhibit 59: Data Table on Comparison by End-user7.3 Consumer electronics – Market size and forecast 2022-2027Exhibit 60: Chart on Consumer electronics – Market size and forecast 2022-2027 (USD million)Exhibit 61: Data Table on Consumer electronics – Market size and forecast 2022-2027 (USD million)Exhibit 62: Chart on Consumer electronics – Year-over-year growth 2022-2027 (%)Exhibit 63: Data Table on Consumer electronics – Year-over-year growth 2022-2027 (%)7.4 Automotive – Market size and forecast 2022-2027Exhibit 64: Chart on Automotive – Market size and forecast 2022-2027 (USD million)Exhibit 65: Data Table on Automotive – Market size and forecast 2022-2027 (USD million)Exhibit 66: Chart on Automotive – Year-over-year growth 2022-2027 (%)Exhibit 67: Data Table on Automotive – Year-over-year growth 2022-2027 (%)7.5 Medical devices – Market size and forecast 2022-2027Exhibit 68: Chart on Medical devices – Market size and forecast 2022-2027 (USD million)Exhibit 69: Data Table on Medical devices – Market size and forecast 2022-2027 (USD million)Exhibit 70: Chart on Medical devices – Year-over-year growth 2022-2027 (%)Exhibit 71: Data Table on Medical devices – Year-over-year growth 2022-2027 (%)7.6 Communication and telecom – Market size and forecast 2022-2027Exhibit 72: Chart on Communication and telecom – Market size and forecast 2022-2027 (USD million)Exhibit 73: Data Table on Communication and telecom – Market size and forecast 2022-2027 (USD million)Exhibit 74: Chart on Communication and telecom – Year-over-year growth 2022-2027 (%)Exhibit 75: Data Table on Communication and telecom – Year-over-year growth 2022-2027 (%)7.7 Others – Market size and forecast 2022-2027Exhibit 76: Chart on Others – Market size and forecast 2022-2027 (USD million)Exhibit 77: Data Table on Others – Market size and forecast 2022-2027 (USD million)Exhibit 78: Chart on Others – Year-over-year growth 2022-2027 (%)Exhibit 79: Data Table on Others – Year-over-year growth 2022-2027 (%)7.8 Market opportunity by End-userExhibit 80: Market opportunity by End-user (USD million)Exhibit 81: Data Table on Market opportunity by End-user (USD million)8 Customer Landscape
8.1 Customer landscape overviewExhibit 82: Analysis of price sensitivity, lifecycle, customer purchase basket, adoption rates, and purchase criteria9 Geographic Landscape
9.1 Geographic segmentationExhibit 83: Chart on Market share by geography 2022-2027 (%)Exhibit 84: Data Table on Market share by geography 2022-2027 (%)9.2 Geographic comparisonExhibit 85: Chart on Geographic comparisonExhibit 86: Data Table on Geographic comparison9.3 APAC – Market size and forecast 2022-2027Exhibit 87: Chart on APAC – Market size and forecast 2022-2027 (USD million)Exhibit 88: Data Table on APAC – Market size and forecast 2022-2027 (USD million)Exhibit 89: Chart on APAC – Year-over-year growth 2022-2027 (%)Exhibit 90: Data Table on APAC – Year-over-year growth 2022-2027 (%)9.4 North America – Market size and forecast 2022-2027Exhibit 91: Chart on North America – Market size and forecast 2022-2027 (USD million)Exhibit 92: Data Table on North America – Market size and forecast 2022-2027 (USD million)Exhibit 93: Chart on North America – Year-over-year growth 2022-2027 (%)Exhibit 94: Data Table on North America – Year-over-year growth 2022-2027 (%)9.5 Europe – Market size and forecast 2022-2027Exhibit 95: Chart on Europe – Market size and forecast 2022-2027 (USD million)Exhibit 96: Data Table on Europe – Market size and forecast 2022-2027 (USD million)Exhibit 97: Chart on Europe – Year-over-year growth 2022-2027 (%)Exhibit 98: Data Table on Europe – Year-over-year growth 2022-2027 (%)9.6 South America – Market size and forecast 2022-2027Exhibit 99: Chart on South America – Market size and forecast 2022-2027 (USD million)Exhibit 100: Data Table on South America – Market size and forecast 2022-2027 (USD million)Exhibit 101: Chart on South America – Year-over-year growth 2022-2027 (%)Exhibit 102: Data Table on South America – Year-over-year growth 2022-2027 (%)9.7 Middle East and Africa – Market size and forecast 2022-2027Exhibit 103: Chart on Middle East and Africa – Market size and forecast 2022-2027 (USD million)Exhibit 104: Data Table on Middle East and Africa – Market size and forecast 2022-2027 (USD million)Exhibit 105: Chart on Middle East and Africa – Year-over-year growth 2022-2027 (%)Exhibit 106: Data Table on Middle East and Africa – Year-over-year growth 2022-2027 (%)9.8 China – Market size and forecast 2022-2027Exhibit 107: Chart on China – Market size and forecast 2022-2027 (USD million)Exhibit 108: Data Table on China – Market size and forecast 2022-2027 (USD million)Exhibit 109: Chart on China – Year-over-year growth 2022-2027 (%)Exhibit 110: Data Table on China – Year-over-year growth 2022-2027 (%)9.9 Taiwan – Market size and forecast 2022-2027Exhibit 111: Chart on Taiwan – Market size and forecast 2022-2027 (USD million)Exhibit 112: Data Table on Taiwan – Market size and forecast 2022-2027 (USD million)Exhibit 113: Chart on Taiwan – Year-over-year growth 2022-2027 (%)Exhibit 114: Data Table on Taiwan – Year-over-year growth 2022-2027 (%)9.10 US – Market size and forecast 2022-2027Exhibit 115: Chart on US – Market size and forecast 2022-2027 (USD million)Exhibit 116: Data Table on US – Market size and forecast 2022-2027 (USD million)Exhibit 117: Chart on US – Year-over-year growth 2022-2027 (%)Exhibit 118: Data Table on US – Year-over-year growth 2022-2027 (%)9.11 Japan – Market size and forecast 2022-2027Exhibit 119: Chart on Japan – Market size and forecast 2022-2027 (USD million)Exhibit 120: Data Table on Japan – Market size and forecast 2022-2027 (USD million)Exhibit 121: Chart on Japan – Year-over-year growth 2022-2027 (%)Exhibit 122: Data Table on Japan – Year-over-year growth 2022-2027 (%)9.12 South Korea – Market size and forecast 2022-2027Exhibit 123: Chart on South Korea – Market size and forecast 2022-2027 (USD million)Exhibit 124: Data Table on South Korea – Market size and forecast 2022-2027 (USD million)Exhibit 125: Chart on South Korea – Year-over-year growth 2022-2027 (%)Exhibit 126: Data Table on South Korea – Year-over-year growth 2022-2027 (%)9.13 Market opportunity by geographyExhibit 127: Market opportunity by geography (USD million)Exhibit 128: Data Tables on Market opportunity by geography (USD million)10 Drivers, Challenges, and Trends
10.1 Market drivers10.2 Market challenges10.3 Impact of drivers and challengesExhibit 129: Impact of drivers and challenges in 2022 and 202710.4 Market trends11 Vendor Landscape
11.1 Overview11.2 Vendor landscapeExhibit 130: Overview on Criticality of inputs and Factors of differentiation11.3 Landscape disruptionExhibit 131: Overview on factors of disruption11.4 Industry risksExhibit 132: Impact of key risks on business12 Vendor Analysis
12.1 Vendors coveredExhibit 133: Vendors covered12.2 Market positioning of vendorsExhibit 134: Matrix on vendor position and classification12.3 Amkor Technology Inc.Exhibit 135: Amkor Technology Inc. – OverviewExhibit 136: Amkor Technology Inc. – Business segmentsExhibit 137: Amkor Technology Inc. – Key offeringsExhibit 138: Amkor Technology Inc. – Segment focus12.4 ASE Technology Holding Co. Ltd.Exhibit 139: ASE Technology Holding Co. Ltd. – OverviewExhibit 140: ASE Technology Holding Co. Ltd. – Business segmentsExhibit 141: ASE Technology Holding Co. Ltd. – Key offeringsExhibit 142: ASE Technology Holding Co. Ltd. – Segment focus12.5 BASF SEExhibit 143: BASF SE – OverviewExhibit 144: BASF SE – Business segmentsExhibit 145: BASF SE – Key newsExhibit 146: BASF SE – Key offeringsExhibit 147: BASF SE – Segment focus12.6 ChipMOS TECHNOLOGIES INC.Exhibit 148: ChipMOS TECHNOLOGIES INC. – OverviewExhibit 149: ChipMOS TECHNOLOGIES INC. – Business segmentsExhibit 150: ChipMOS TECHNOLOGIES INC. – Key offeringsExhibit 151: ChipMOS TECHNOLOGIES INC. – Segment focus12.7 DuPont de Nemours Inc.Exhibit 152: DuPont de Nemours Inc. – OverviewExhibit 153: DuPont de Nemours Inc. – Business segmentsExhibit 154: DuPont de Nemours Inc. – Key newsExhibit 155: DuPont de Nemours Inc. – Key offeringsExhibit 156: DuPont de Nemours Inc. – Segment focus12.8 Henkel AG and Co. KGaAExhibit 157: Henkel AG and Co. KGaA – OverviewExhibit 158: Henkel AG and Co. KGaA – Business segmentsExhibit 159: Henkel AG and Co. KGaA – Key newsExhibit 160: Henkel AG and Co. KGaA – Key offeringsExhibit 161: Henkel AG and Co. KGaA – Segment focus12.9 Heraeus Holding GmbHExhibit 162: Heraeus Holding GmbH – OverviewExhibit 163: Heraeus Holding GmbH – Product / ServiceExhibit 164: Heraeus Holding GmbH – Key offerings12.10 Hitachi Ltd.Exhibit 165: Hitachi Ltd. – OverviewExhibit 166: Hitachi Ltd. – Business segmentsExhibit 167: Hitachi Ltd. – Key newsExhibit 168: Hitachi Ltd. – Key offeringsExhibit 169: Hitachi Ltd. – Segment focus12.11 Honeywell International Inc.Exhibit 170: Honeywell International Inc. – OverviewExhibit 171: Honeywell International Inc. – Business segmentsExhibit 172: Honeywell International Inc. – Key newsExhibit 173: Honeywell International Inc. – Key offeringsExhibit 174: Honeywell International Inc. – Segment focus12.12 Intel Corp.Exhibit 175: Intel Corp. – OverviewExhibit 176: Intel Corp. – Business segmentsExhibit 177: Intel Corp. – Key newsExhibit 178: Intel Corp. – Key offeringsExhibit 179: Intel Corp. – Segment focus12.13 KYOCERA Corp.Exhibit 180: KYOCERA Corp. – OverviewExhibit 181: KYOCERA Corp. – Business segmentsExhibit 182: KYOCERA Corp. – Key newsExhibit 183: KYOCERA Corp. – Key offeringsExhibit 184: KYOCERA Corp. – Segment focus12.14 Nippon Steel Corp.Exhibit 185: Nippon Steel Corp. – OverviewExhibit 186: Nippon Steel Corp. – Business segmentsExhibit 187: Nippon Steel Corp. – Key offeringsExhibit 188: Nippon Steel Corp. – Segment focus12.15 Powertech Technology Inc.Exhibit 189: Powertech Technology Inc. – OverviewExhibit 190: Powertech Technology Inc. – Business segmentsExhibit 191: Powertech Technology Inc. – Key offeringsExhibit 192: Powertech Technology Inc. – Segment focus12.16 Samsung Electronics Co. Ltd.Exhibit 193: Samsung Electronics Co. Ltd. – OverviewExhibit 194: Samsung Electronics Co. Ltd. – Business segmentsExhibit 195: Samsung Electronics Co. Ltd. – Key newsExhibit 196: Samsung Electronics Co. Ltd. – Key offeringsExhibit 197: Samsung Electronics Co. Ltd. – Segment focus12.17 Texas Instruments Inc.Exhibit 198: Texas Instruments Inc. – OverviewExhibit 199: Texas Instruments Inc. – Business segmentsExhibit 200: Texas Instruments Inc. – Key newsExhibit 201: Texas Instruments Inc. – Key offeringsExhibit 202: Texas Instruments Inc. – Segment focus13 Appendix
13.1 Scope of the report13.2 Inclusions and exclusions checklistExhibit 203: Inclusions checklistExhibit 204: Exclusions checklist13.3 Currency conversion rates for USUSDExhibit 205: Currency conversion rates for USUSD13.4 Research methodologyExhibit 206: Research methodologyExhibit 207: Validation techniques employed for market sizingExhibit 208: Information sources13.5 List of abbreviationsExhibit 209: List of abbreviationsAbout US
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SOURCE Technavio
NEW YORK, Aug. 17, 2023 /PRNewswire/ — The semiconductor packaging materials market is expected to grow by USD 10,158.72 million from 2022 to 2027, according to Technavio. As per the latest report, the market will progress at a CAGR of 6.06% during the forecast period. The increase in the adoption of semiconductor ICs for automobiles and the shift toward copper as bonding wire material is an emerging market trend. The rising need for semiconductor wafers is due to the automation and electrification of automobiles. Anti-lock braking systems, car navigation, airbag control, GPS, and display, power doors and windows, collision detection technology, infotainment, and automated driving are some of the major benefits. Hence, such factors drive the growth of the market during the forecast period. View a Sample Report within minutes!
Semiconductor Packaging Materials Market 2023-2027: Scope
Technavio presents a detailed picture of the market by way of study, synthesis, and summation of data from multiple sources. Our semiconductor packaging materials market report covers the following areas:
Semiconductor Packaging Materials Market sizeSemiconductor Packaging Materials Market trendsSemiconductor Packaging Materials Market industry analysisSemiconductor Packaging Materials Market five forces analysisSemiconductor Packaging Materials Market competitive landscape
Semiconductor Packaging Materials Market 2023-2027 : Segmentation
Semiconductor Packaging Materials Market is segmented as below:
Material Organic SubstratesLead FramesBonding WiresCeramic PackagesOthersEnd-user Consumer ElectronicsAutomotiveMedical DevicesCommunication And TelecomOthersGeography APACNorth AmericaEuropeSouth AmericaMiddle East And Africa
The organic substrates segment will be significant during the forecast period. The rising demand is since these materials are used these materials are base layers of individual semiconductor devices and ICs on which other layers are deposited to complete the circuit. Such materials are a part of the circuit, and it is important that these are efficient conductors of electricity and thinner core materials. Hence, such factors boost the segment growth during the forecast period.
To learn more about the global trends impacting the future of market research, download a sample report!
Semiconductor Packaging Materials Market 2023-2027: Market Dynamics
The rise in global demand for consumers drives market growth. The market growth can be attributed to factors such as the rise in the sales of smart devices such as smartwatches, smartphones, and smart bands globally. Resultantly, it has fuelled the growth of semiconductor packaging materials. Some of the key applications of IC and semiconductors include Tablets and smartphones. Hence, such factors boost the market growth of the semiconductor packaging materials market during the forecast period.
Regulations associated with semiconductor packaging materials challenge market growth. Complying with strict material specifications set down by packaging assemblers and testers is a major challenge. Packaging chemical and materials suppliers are facing increased environmental regulations, especially in developing countries because there is a growing concern for environmental hazards related to packaging. Hence, such challenges impede the market growth during the forecast period.
What’s New? –
Special coverage on the Russia–Ukraine war; global inflation; recovery analysis from COVID-19; supply chain disruptions, global trade tensions; and risk of recessionGlobal competitiveness and key competitor positionsMarket presence across multiple geographical footprints – Strong/Active/Niche/Trivial – Buy the report!
Semiconductor Packaging Materials Market 2023-2027: Company Analysis
We provide a detailed analysis of around 25 companies operating in the Semiconductor Packaging Materials Market, including some of the companies such as Amkor Technology Inc., ASE Technology Holding Co. Ltd., BASF SE, ChipMOS TECHNOLOGIES INC., DuPont de Nemours Inc., Henkel AG and Co. KGaA, Heraeus Holding GmbH, Hitachi Ltd., Honeywell International Inc., Indium Corp., Intel Corp., KYOCERA Corp., LG Innotek Co. Ltd., MITSUI and CO. LTD., Nan Ya Printed Circuit Board Corp., Nippon Steel Corp., Powertech Technology Inc., Samsung Electronics Co. Ltd., Taiwan SEMICONDUCTOR CO. LTD, and Texas Instruments Inc. Backed with competitive intelligence and benchmarking, our research reports on the Semiconductor Packaging Materials Market are designed to provide entry support, customer profile, and M&As as well as go-to-market strategy support.
Company Offerings
Amkor Technology Inc. – The company offers semiconductor packaging materials such as copper leadframe substrates.ASE Technology Holding Co. Ltd. – The company offers semiconductor packaging materials such as flip-chip chip scale package substrate.BASF SE – The company offers semiconductor packaging materials such as Ultrapure electronic materials.
Semiconductor Packaging Materials Market 2023-2027: Key Highlights
CAGR of the market during the forecast period 2023-2027Detailed information on factors that will assist semiconductor packaging materials market growth during the next five yearsEstimation of the semiconductor packaging materials market size and its contribution to the parent marketPredictions on upcoming trends and changes in consumer behaviorThe growth of the semiconductor packaging materials marketAnalysis of the market’s competitive landscape and detailed information on vendorsComprehensive details of factors that will challenge the growth of semiconductor packaging materials market vendors
Gain instant access to 17,000+ market research reports.
Technavio’s SUBSCRIPTION platform
Related Reports:
The secondary packaging market size is estimated to grow at a CAGR of 4.04% between 2022 and 2027. The market size is forecast to increase by USD 72.19 billion. This secondary packaging market report extensively covers market segmentation by type (paper and plastic), application (food, beverages, pharmaceuticals, personal and home care, and others), and geography (North America, Europe, APAC, South America, and Middle East and Africa). The increasing demand for processed and packaged foods is notably driving the market growth.
The Mexico packaging market size is estimated to grow at a CAGR of 3.51% between 2022 and 2027. The market size is forecast to increase by USD 2,333.59 million. This Mexico packaging market report extensively covers market segmentation by end-user (food, beverage, healthcare, personal care, and others), and type (board, rigid plastic, flexible, metal, and glass). The growing consumer demand for packaged food products is driving growth in the Mexico packaging market.
Semiconductor Packaging Materials Market Scope
Report Coverage
Details
Base year
2022
Historic period
2017-2021
Forecast period
2023-2027
Growth momentum & CAGR
Accelerate at a CAGR of 6.06%
Market growth 2023-2027
USD 10,158.72 million
Market structure
Fragmented
YoY growth 2022- 2023 (%)
4.52
Regional analysis
APAC, North America, Europe, South America, and Middle East and Africa
Performing market contribution
APAC at 70%
Key countries
US, China, Taiwan, Japan, and South Korea
Competitive landscape
Leading Vendors, Market Positioning of Vendors, Competitive Strategies, and Industry Risks
Key companies profiled
Amkor Technology Inc., ASE Technology Holding Co. Ltd., BASF SE, ChipMOS TECHNOLOGIES INC., DuPont de Nemours Inc., Henkel AG and Co. KGaA, Heraeus Holding GmbH, Hitachi Ltd., Honeywell International Inc., Indium Corp., Intel Corp., KYOCERA Corp., LG Innotek Co. Ltd., MITSUI and CO. LTD., Nan Ya Printed Circuit Board Corp., Nippon Steel Corp., Powertech Technology Inc., Samsung Electronics Co. Ltd., Taiwan SEMICONDUCTOR CO. LTD, and Texas Instruments Inc.
Market dynamics
Parent market analysis, Market growth inducers and obstacles, Fast-growing and slow-growing segment analysis, COVID-19 impact and recovery analysis and future consumer dynamics, Market condition analysis for forecast period.
Customization purview
If our report has not included the data that you are looking for, you can reach out to our analysts and get segments customized.
Table Of Contents :
1 Executive Summary
1.1 Market overviewExhibit 01: Executive Summary – Chart on Market OverviewExhibit 02: Executive Summary – Data Table on Market OverviewExhibit 03: Executive Summary – Chart on Global Market CharacteristicsExhibit 04: Executive Summary – Chart on Market by GeographyExhibit 05: Executive Summary – Chart on Market Segmentation by MaterialExhibit 06: Executive Summary – Chart on Market Segmentation by End-userExhibit 07: Executive Summary – Chart on Incremental GrowthExhibit 08: Executive Summary – Data Table on Incremental GrowthExhibit 09: Executive Summary – Chart on Vendor Market Positioning
2 Market Landscape
2.1 Market ecosystemExhibit 10: Parent marketExhibit 11: Market Characteristics
3 Market Sizing
3.1 Market definitionExhibit 12: Offerings of vendors included in the market definition3.2 Market segment analysisExhibit 13: Market segments3.3 Market size 20223.4 Market outlook: Forecast for 2022-2027Exhibit 14: Chart on Global – Market size and forecast 2022-2027 (USD million)Exhibit 15: Data Table on Global – Market size and forecast 2022-2027 (USD million)Exhibit 16: Chart on Global Market: Year-over-year growth 2022-2027 (%)Exhibit 17: Data Table on Global Market: Year-over-year growth 2022-2027 (%)
4 Historic Market Size
4.1 Global semiconductor packaging materials market 2017 – 2021Exhibit 18: Historic Market Size – Data Table on global semiconductor packaging materials market 2017 – 2021 (USD million)4.2 Material Segment Analysis 2017 – 2021Exhibit 19: Historic Market Size – Material Segment 2017 – 2021 (USD million)4.3 End-user Segment Analysis 2017 – 2021Exhibit 20: Historic Market Size – End-user Segment 2017 – 2021 (USD million)4.4 Geography Segment Analysis 2017 – 2021Exhibit 21: Historic Market Size – Geography Segment 2017 – 2021 (USD million)4.5 Country Segment Analysis 2017 – 2021Exhibit 22: Historic Market Size – Country Segment 2017 – 2021 (USD million)
5 Five Forces Analysis
5.1 Five forces summaryExhibit 23: Five forces analysis – Comparison between 2022 and 20275.2 Bargaining power of buyersExhibit 24: Chart on Bargaining power of buyers – Impact of key factors 2022 and 20275.3 Bargaining power of suppliersExhibit 25: Bargaining power of suppliers – Impact of key factors in 2022 and 20275.4 Threat of new entrantsExhibit 26: Threat of new entrants – Impact of key factors in 2022 and 20275.5 Threat of substitutesExhibit 27: Threat of substitutes – Impact of key factors in 2022 and 20275.6 Threat of rivalryExhibit 28: Threat of rivalry – Impact of key factors in 2022 and 20275.7 Market conditionExhibit 29: Chart on Market condition – Five forces 2022 and 2027
6 Market Segmentation by Material
6.1 Market segmentsExhibit 30: Chart on Material – Market share 2022-2027 (%)Exhibit 31: Data Table on Material – Market share 2022-2027 (%)6.2 Comparison by MaterialExhibit 32: Chart on Comparison by MaterialExhibit 33: Data Table on Comparison by Material6.3 Organic substrates – Market size and forecast 2022-2027Exhibit 34: Chart on Organic substrates – Market size and forecast 2022-2027 (USD million)Exhibit 35: Data Table on Organic substrates – Market size and forecast 2022-2027 (USD million)Exhibit 36: Chart on Organic substrates – Year-over-year growth 2022-2027 (%)Exhibit 37: Data Table on Organic substrates – Year-over-year growth 2022-2027 (%)6.4 Lead frames – Market size and forecast 2022-2027Exhibit 38: Chart on Lead frames – Market size and forecast 2022-2027 (USD million)Exhibit 39: Data Table on Lead frames – Market size and forecast 2022-2027 (USD million)Exhibit 40: Chart on Lead frames – Year-over-year growth 2022-2027 (%)Exhibit 41: Data Table on Lead frames – Year-over-year growth 2022-2027 (%)6.5 Bonding wires – Market size and forecast 2022-2027Exhibit 42: Chart on Bonding wires – Market size and forecast 2022-2027 (USD million)Exhibit 43: Data Table on Bonding wires – Market size and forecast 2022-2027 (USD million)Exhibit 44: Chart on Bonding wires – Year-over-year growth 2022-2027 (%)Exhibit 45: Data Table on Bonding wires – Year-over-year growth 2022-2027 (%)6.6 Ceramic packages – Market size and forecast 2022-2027Exhibit 46: Chart on Ceramic packages – Market size and forecast 2022-2027 (USD million)Exhibit 47: Data Table on Ceramic packages – Market size and forecast 2022-2027 (USD million)Exhibit 48: Chart on Ceramic packages – Year-over-year growth 2022-2027 (%)Exhibit 49: Data Table on Ceramic packages – Year-over-year growth 2022-2027 (%)6.7 Others – Market size and forecast 2022-2027Exhibit 50: Chart on Others – Market size and forecast 2022-2027 (USD million)Exhibit 51: Data Table on Others – Market size and forecast 2022-2027 (USD million)Exhibit 52: Chart on Others – Year-over-year growth 2022-2027 (%)Exhibit 53: Data Table on Others – Year-over-year growth 2022-2027 (%)6.8 Market opportunity by MaterialExhibit 54: Market opportunity by Material (USD million)Exhibit 55: Data Table on Market opportunity by Material (USD million)
7 Market Segmentation by End-user
7.1 Market segmentsExhibit 56: Chart on End-user – Market share 2022-2027 (%)Exhibit 57: Data Table on End-user – Market share 2022-2027 (%)7.2 Comparison by End-userExhibit 58: Chart on Comparison by End-userExhibit 59: Data Table on Comparison by End-user7.3 Consumer electronics – Market size and forecast 2022-2027Exhibit 60: Chart on Consumer electronics – Market size and forecast 2022-2027 (USD million)Exhibit 61: Data Table on Consumer electronics – Market size and forecast 2022-2027 (USD million)Exhibit 62: Chart on Consumer electronics – Year-over-year growth 2022-2027 (%)Exhibit 63: Data Table on Consumer electronics – Year-over-year growth 2022-2027 (%)7.4 Automotive – Market size and forecast 2022-2027Exhibit 64: Chart on Automotive – Market size and forecast 2022-2027 (USD million)Exhibit 65: Data Table on Automotive – Market size and forecast 2022-2027 (USD million)Exhibit 66: Chart on Automotive – Year-over-year growth 2022-2027 (%)Exhibit 67: Data Table on Automotive – Year-over-year growth 2022-2027 (%)7.5 Medical devices – Market size and forecast 2022-2027Exhibit 68: Chart on Medical devices – Market size and forecast 2022-2027 (USD million)Exhibit 69: Data Table on Medical devices – Market size and forecast 2022-2027 (USD million)Exhibit 70: Chart on Medical devices – Year-over-year growth 2022-2027 (%)Exhibit 71: Data Table on Medical devices – Year-over-year growth 2022-2027 (%)7.6 Communication and telecom – Market size and forecast 2022-2027Exhibit 72: Chart on Communication and telecom – Market size and forecast 2022-2027 (USD million)Exhibit 73: Data Table on Communication and telecom – Market size and forecast 2022-2027 (USD million)Exhibit 74: Chart on Communication and telecom – Year-over-year growth 2022-2027 (%)Exhibit 75: Data Table on Communication and telecom – Year-over-year growth 2022-2027 (%)7.7 Others – Market size and forecast 2022-2027Exhibit 76: Chart on Others – Market size and forecast 2022-2027 (USD million)Exhibit 77: Data Table on Others – Market size and forecast 2022-2027 (USD million)Exhibit 78: Chart on Others – Year-over-year growth 2022-2027 (%)Exhibit 79: Data Table on Others – Year-over-year growth 2022-2027 (%)7.8 Market opportunity by End-userExhibit 80: Market opportunity by End-user (USD million)Exhibit 81: Data Table on Market opportunity by End-user (USD million)
8 Customer Landscape
8.1 Customer landscape overviewExhibit 82: Analysis of price sensitivity, lifecycle, customer purchase basket, adoption rates, and purchase criteria
9 Geographic Landscape
9.1 Geographic segmentationExhibit 83: Chart on Market share by geography 2022-2027 (%)Exhibit 84: Data Table on Market share by geography 2022-2027 (%)9.2 Geographic comparisonExhibit 85: Chart on Geographic comparisonExhibit 86: Data Table on Geographic comparison9.3 APAC – Market size and forecast 2022-2027Exhibit 87: Chart on APAC – Market size and forecast 2022-2027 (USD million)Exhibit 88: Data Table on APAC – Market size and forecast 2022-2027 (USD million)Exhibit 89: Chart on APAC – Year-over-year growth 2022-2027 (%)Exhibit 90: Data Table on APAC – Year-over-year growth 2022-2027 (%)9.4 North America – Market size and forecast 2022-2027Exhibit 91: Chart on North America – Market size and forecast 2022-2027 (USD million)Exhibit 92: Data Table on North America – Market size and forecast 2022-2027 (USD million)Exhibit 93: Chart on North America – Year-over-year growth 2022-2027 (%)Exhibit 94: Data Table on North America – Year-over-year growth 2022-2027 (%)9.5 Europe – Market size and forecast 2022-2027Exhibit 95: Chart on Europe – Market size and forecast 2022-2027 (USD million)Exhibit 96: Data Table on Europe – Market size and forecast 2022-2027 (USD million)Exhibit 97: Chart on Europe – Year-over-year growth 2022-2027 (%)Exhibit 98: Data Table on Europe – Year-over-year growth 2022-2027 (%)9.6 South America – Market size and forecast 2022-2027Exhibit 99: Chart on South America – Market size and forecast 2022-2027 (USD million)Exhibit 100: Data Table on South America – Market size and forecast 2022-2027 (USD million)Exhibit 101: Chart on South America – Year-over-year growth 2022-2027 (%)Exhibit 102: Data Table on South America – Year-over-year growth 2022-2027 (%)9.7 Middle East and Africa – Market size and forecast 2022-2027Exhibit 103: Chart on Middle East and Africa – Market size and forecast 2022-2027 (USD million)Exhibit 104: Data Table on Middle East and Africa – Market size and forecast 2022-2027 (USD million)Exhibit 105: Chart on Middle East and Africa – Year-over-year growth 2022-2027 (%)Exhibit 106: Data Table on Middle East and Africa – Year-over-year growth 2022-2027 (%)9.8 China – Market size and forecast 2022-2027Exhibit 107: Chart on China – Market size and forecast 2022-2027 (USD million)Exhibit 108: Data Table on China – Market size and forecast 2022-2027 (USD million)Exhibit 109: Chart on China – Year-over-year growth 2022-2027 (%)Exhibit 110: Data Table on China – Year-over-year growth 2022-2027 (%)9.9 Taiwan – Market size and forecast 2022-2027Exhibit 111: Chart on Taiwan – Market size and forecast 2022-2027 (USD million)Exhibit 112: Data Table on Taiwan – Market size and forecast 2022-2027 (USD million)Exhibit 113: Chart on Taiwan – Year-over-year growth 2022-2027 (%)Exhibit 114: Data Table on Taiwan – Year-over-year growth 2022-2027 (%)9.10 US – Market size and forecast 2022-2027Exhibit 115: Chart on US – Market size and forecast 2022-2027 (USD million)Exhibit 116: Data Table on US – Market size and forecast 2022-2027 (USD million)Exhibit 117: Chart on US – Year-over-year growth 2022-2027 (%)Exhibit 118: Data Table on US – Year-over-year growth 2022-2027 (%)9.11 Japan – Market size and forecast 2022-2027Exhibit 119: Chart on Japan – Market size and forecast 2022-2027 (USD million)Exhibit 120: Data Table on Japan – Market size and forecast 2022-2027 (USD million)Exhibit 121: Chart on Japan – Year-over-year growth 2022-2027 (%)Exhibit 122: Data Table on Japan – Year-over-year growth 2022-2027 (%)9.12 South Korea – Market size and forecast 2022-2027Exhibit 123: Chart on South Korea – Market size and forecast 2022-2027 (USD million)Exhibit 124: Data Table on South Korea – Market size and forecast 2022-2027 (USD million)Exhibit 125: Chart on South Korea – Year-over-year growth 2022-2027 (%)Exhibit 126: Data Table on South Korea – Year-over-year growth 2022-2027 (%)9.13 Market opportunity by geographyExhibit 127: Market opportunity by geography (USD million)Exhibit 128: Data Tables on Market opportunity by geography (USD million)
10 Drivers, Challenges, and Trends
10.1 Market drivers10.2 Market challenges10.3 Impact of drivers and challengesExhibit 129: Impact of drivers and challenges in 2022 and 202710.4 Market trends
11 Vendor Landscape
11.1 Overview11.2 Vendor landscapeExhibit 130: Overview on Criticality of inputs and Factors of differentiation11.3 Landscape disruptionExhibit 131: Overview on factors of disruption11.4 Industry risksExhibit 132: Impact of key risks on business
12 Vendor Analysis
12.1 Vendors coveredExhibit 133: Vendors covered12.2 Market positioning of vendorsExhibit 134: Matrix on vendor position and classification12.3 Amkor Technology Inc.Exhibit 135: Amkor Technology Inc. – OverviewExhibit 136: Amkor Technology Inc. – Business segmentsExhibit 137: Amkor Technology Inc. – Key offeringsExhibit 138: Amkor Technology Inc. – Segment focus12.4 ASE Technology Holding Co. Ltd.Exhibit 139: ASE Technology Holding Co. Ltd. – OverviewExhibit 140: ASE Technology Holding Co. Ltd. – Business segmentsExhibit 141: ASE Technology Holding Co. Ltd. – Key offeringsExhibit 142: ASE Technology Holding Co. Ltd. – Segment focus12.5 BASF SEExhibit 143: BASF SE – OverviewExhibit 144: BASF SE – Business segmentsExhibit 145: BASF SE – Key newsExhibit 146: BASF SE – Key offeringsExhibit 147: BASF SE – Segment focus12.6 ChipMOS TECHNOLOGIES INC.Exhibit 148: ChipMOS TECHNOLOGIES INC. – OverviewExhibit 149: ChipMOS TECHNOLOGIES INC. – Business segmentsExhibit 150: ChipMOS TECHNOLOGIES INC. – Key offeringsExhibit 151: ChipMOS TECHNOLOGIES INC. – Segment focus12.7 DuPont de Nemours Inc.Exhibit 152: DuPont de Nemours Inc. – OverviewExhibit 153: DuPont de Nemours Inc. – Business segmentsExhibit 154: DuPont de Nemours Inc. – Key newsExhibit 155: DuPont de Nemours Inc. – Key offeringsExhibit 156: DuPont de Nemours Inc. – Segment focus12.8 Henkel AG and Co. KGaAExhibit 157: Henkel AG and Co. KGaA – OverviewExhibit 158: Henkel AG and Co. KGaA – Business segmentsExhibit 159: Henkel AG and Co. KGaA – Key newsExhibit 160: Henkel AG and Co. KGaA – Key offeringsExhibit 161: Henkel AG and Co. KGaA – Segment focus12.9 Heraeus Holding GmbHExhibit 162: Heraeus Holding GmbH – OverviewExhibit 163: Heraeus Holding GmbH – Product / ServiceExhibit 164: Heraeus Holding GmbH – Key offerings12.10 Hitachi Ltd.Exhibit 165: Hitachi Ltd. – OverviewExhibit 166: Hitachi Ltd. – Business segmentsExhibit 167: Hitachi Ltd. – Key newsExhibit 168: Hitachi Ltd. – Key offeringsExhibit 169: Hitachi Ltd. – Segment focus12.11 Honeywell International Inc.Exhibit 170: Honeywell International Inc. – OverviewExhibit 171: Honeywell International Inc. – Business segmentsExhibit 172: Honeywell International Inc. – Key newsExhibit 173: Honeywell International Inc. – Key offeringsExhibit 174: Honeywell International Inc. – Segment focus12.12 Intel Corp.Exhibit 175: Intel Corp. – OverviewExhibit 176: Intel Corp. – Business segmentsExhibit 177: Intel Corp. – Key newsExhibit 178: Intel Corp. – Key offeringsExhibit 179: Intel Corp. – Segment focus12.13 KYOCERA Corp.Exhibit 180: KYOCERA Corp. – OverviewExhibit 181: KYOCERA Corp. – Business segmentsExhibit 182: KYOCERA Corp. – Key newsExhibit 183: KYOCERA Corp. – Key offeringsExhibit 184: KYOCERA Corp. – Segment focus12.14 Nippon Steel Corp.Exhibit 185: Nippon Steel Corp. – OverviewExhibit 186: Nippon Steel Corp. – Business segmentsExhibit 187: Nippon Steel Corp. – Key offeringsExhibit 188: Nippon Steel Corp. – Segment focus12.15 Powertech Technology Inc.Exhibit 189: Powertech Technology Inc. – OverviewExhibit 190: Powertech Technology Inc. – Business segmentsExhibit 191: Powertech Technology Inc. – Key offeringsExhibit 192: Powertech Technology Inc. – Segment focus12.16 Samsung Electronics Co. Ltd.Exhibit 193: Samsung Electronics Co. Ltd. – OverviewExhibit 194: Samsung Electronics Co. Ltd. – Business segmentsExhibit 195: Samsung Electronics Co. Ltd. – Key newsExhibit 196: Samsung Electronics Co. Ltd. – Key offeringsExhibit 197: Samsung Electronics Co. Ltd. – Segment focus12.17 Texas Instruments Inc.Exhibit 198: Texas Instruments Inc. – OverviewExhibit 199: Texas Instruments Inc. – Business segmentsExhibit 200: Texas Instruments Inc. – Key newsExhibit 201: Texas Instruments Inc. – Key offeringsExhibit 202: Texas Instruments Inc. – Segment focus
13 Appendix
13.1 Scope of the report13.2 Inclusions and exclusions checklistExhibit 203: Inclusions checklistExhibit 204: Exclusions checklist13.3 Currency conversion rates for USUSDExhibit 205: Currency conversion rates for USUSD13.4 Research methodologyExhibit 206: Research methodologyExhibit 207: Validation techniques employed for market sizingExhibit 208: Information sources13.5 List of abbreviationsExhibit 209: List of abbreviations
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