DUBLIN , Sept. 11, 2023 /PRNewswire/ — The “Global SiC Wafer Polishing Market by Product Type (Abrasive Powders, Polishing Pads, Diamond Slurries, Colloidal Silica Suspensions), Application, Process, & Region (North America, Europe, APAC, South America, MEA) – Forecast 2028” report has been added to ResearchAndMarkets.com’s offering.
The Sic wafer polishing market is poised for extraordinary growth, with predictions indicating an expansion from $0.4 billion in 2023 to a staggering $2.2 billion by 2028, showcasing an impressive CAGR of 37.5% during the forecast period.
The market’s surge is primarily driven by the escalating demand for SiC wafers in critical sectors such as power electronics, automotive, aerospace, and telecommunications. SiC wafers, known for their exceptional properties including high thermal conductivity and wide bandgap, have become indispensable for advanced devices requiring enhanced efficiency and performance. Furthermore, the increasing adoption of SiC-based devices in renewable energy systems and electric vehicles is fueling the demand for high-quality polished wafers.
Diamond Slurry Sic Wafer Polishing Centrifuges: The Pinnacle Product
The diamond slurry Sic wafer polishing centrifuges segment is anticipated to be the fastest-growing product type in the Sic wafer polishing market from 2023 to 2028. These centrifuges, enriched with the inherent hardness and sharpness of diamond particles, have proven highly effective in addressing the challenges posed by SiC wafers.
They deliver precise material removal and exceptional surface smoothness, meeting the stringent demands of SiC-based power electronics, optoelectronics, and high-frequency devices. As the demand for such devices continues to surge, manufacturers are actively seeking advanced and reliable polishing solutions, with diamond slurry products emerging as the preferred choice due to their outstanding control over material removal rates and superior planarization, resulting in heightened device performance and yield.
Chemical Mechanical Polishing (CMP): The Leading Process
Among the various processes, chemical mechanical polishing (CMP) is expected to be the fastest-growing segment in the Sic wafer polishing market from 2023 to 2028. CMP stands out for its unique ability to provide highly controlled and precise polishing procedures. Combining chemical reactions with mechanical abrasion, CMP delivers superior planarization and surface smoothness on SiC wafers, prerequisites for high-performance semiconductor devices.
Its success is further attributed to its compatibility with diverse SiC substrate types and its capacity to handle larger wafer sizes, aligning with the semiconductor industry’s aspirations for advanced applications. Additionally, CMP’s efficacy in eliminating flaws and impurities from SiC wafers makes it the preferred method for producing reliable and high-quality devices.
Asia Pacific: The Epicenter of Growth
The Asia Pacific region is poised to witness the highest CAGR in the Sic wafer polishing market from 2023 to 2028. This projection is rooted in the region’s pivotal role as a major electronics and semiconductor industry hub, with countries like China, Japan, South Korea, and Taiwan playing significant roles in global semiconductor production. The burgeoning demand for SiC-based devices, including power electronics, RF components, and LEDs, has spurred the need for high-quality polished SiC wafers, underpinning the market’s expansion.
Premium Insights:
Increasing Awareness of Sustainable Technology Driving Market During Forecast PeriodChemical and China Accounted for Significant Share in 2022Diamond Slurries Segment to Account for Largest Share by 2028Power Electronics Segment to Account for Largest Share in 2028Chemical Mechanical Polishing Segment to Account for Largest Share in 2028Asia-Pacific to Account for Largest Share of Sic Wafer Polishing Market in 2023Market Dynamics:
Drivers:
Growing Consumption of Consumer ElectronicsGrowing Demand for Sic-Based Power DevicesDevelopment of Advanced Polishing ConsumablesAdoption of Sic Wafers in Radio Frequency (RF) DevicesRestraints:
Surface Defects and ContaminationLong Polishing Cycle TimesLimited Supplier BaseOpportunities:
Growing Investments in Sic R&DEmergence of New ApplicationsAdvancements in Polishing TechnologiesChallenges:
Complexity Regarding ManufacturingIntense Competition and Market ConsolidationCompanies Mentioned:
3MAce Nanochem Co., Ltd.Advanced Abrasives CorporationAGC Inc.Allied High Tech ProductsDuPont IncorporatedEngis CorporationEntegrisFerro CorporationFujibo Holdings, Inc.Fujifilm Holdings America CorporationFujimi IncorporatedIljin Diamond Co., Ltd.JSR CorporationKemet International LimitedLapmaster WoltersLogitech Ltd.Nitta DuPont IncorporatedPureonSaint-GobainShanghai Xinanna Electronic Technology Co., LtdSKCFor more information about this report visit https://www.researchandmarkets.com/r/j05lqp
About ResearchAndMarkets.comResearchAndMarkets.com is the world’s leading source for international market research reports and market data. We provide you with the latest data on international and regional markets, key industries, the top companies, new products and the latest trends.
Media Contact:Research and MarketsLaura Wood, Senior Managerpress@researchandmarkets.com For E.S.T Office Hours Call +1-917-300-0470For U.S./CAN Toll Free Call +1-800-526-8630For GMT Office Hours Call +353-1-416-8900 U.S. Fax: 646-607-1907Fax (outside U.S.): +353-1-481-1716
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View original content:https://www.prnewswire.com/news-releases/asia-pacific-emerges-as-epicenter-of-sic-wafer-polishing-market-growth-driven-by-robust-electronics-and-semiconductor-industry-301923266.html
SOURCE Research and Markets
DUBLIN , Sept. 11, 2023 /PRNewswire/ — The “Global SiC Wafer Polishing Market by Product Type (Abrasive Powders, Polishing Pads, Diamond Slurries, Colloidal Silica Suspensions), Application, Process, & Region (North America, Europe, APAC, South America, MEA) – Forecast 2028″ report has been added to ResearchAndMarkets.com’s offering.
The Sic wafer polishing market is poised for extraordinary growth, with predictions indicating an expansion from $0.4 billion in 2023 to a staggering $2.2 billion by 2028, showcasing an impressive CAGR of 37.5% during the forecast period.
The market’s surge is primarily driven by the escalating demand for SiC wafers in critical sectors such as power electronics, automotive, aerospace, and telecommunications. SiC wafers, known for their exceptional properties including high thermal conductivity and wide bandgap, have become indispensable for advanced devices requiring enhanced efficiency and performance. Furthermore, the increasing adoption of SiC-based devices in renewable energy systems and electric vehicles is fueling the demand for high-quality polished wafers.
Diamond Slurry Sic Wafer Polishing Centrifuges: The Pinnacle Product
The diamond slurry Sic wafer polishing centrifuges segment is anticipated to be the fastest-growing product type in the Sic wafer polishing market from 2023 to 2028. These centrifuges, enriched with the inherent hardness and sharpness of diamond particles, have proven highly effective in addressing the challenges posed by SiC wafers.
They deliver precise material removal and exceptional surface smoothness, meeting the stringent demands of SiC-based power electronics, optoelectronics, and high-frequency devices. As the demand for such devices continues to surge, manufacturers are actively seeking advanced and reliable polishing solutions, with diamond slurry products emerging as the preferred choice due to their outstanding control over material removal rates and superior planarization, resulting in heightened device performance and yield.
Chemical Mechanical Polishing (CMP): The Leading Process
Among the various processes, chemical mechanical polishing (CMP) is expected to be the fastest-growing segment in the Sic wafer polishing market from 2023 to 2028. CMP stands out for its unique ability to provide highly controlled and precise polishing procedures. Combining chemical reactions with mechanical abrasion, CMP delivers superior planarization and surface smoothness on SiC wafers, prerequisites for high-performance semiconductor devices.
Its success is further attributed to its compatibility with diverse SiC substrate types and its capacity to handle larger wafer sizes, aligning with the semiconductor industry’s aspirations for advanced applications. Additionally, CMP’s efficacy in eliminating flaws and impurities from SiC wafers makes it the preferred method for producing reliable and high-quality devices.
Asia Pacific: The Epicenter of Growth
The Asia Pacific region is poised to witness the highest CAGR in the Sic wafer polishing market from 2023 to 2028. This projection is rooted in the region’s pivotal role as a major electronics and semiconductor industry hub, with countries like China, Japan, South Korea, and Taiwan playing significant roles in global semiconductor production. The burgeoning demand for SiC-based devices, including power electronics, RF components, and LEDs, has spurred the need for high-quality polished SiC wafers, underpinning the market’s expansion.
Premium Insights:
Increasing Awareness of Sustainable Technology Driving Market During Forecast PeriodChemical and China Accounted for Significant Share in 2022Diamond Slurries Segment to Account for Largest Share by 2028Power Electronics Segment to Account for Largest Share in 2028Chemical Mechanical Polishing Segment to Account for Largest Share in 2028Asia-Pacific to Account for Largest Share of Sic Wafer Polishing Market in 2023
Market Dynamics:
Drivers:
Growing Consumption of Consumer ElectronicsGrowing Demand for Sic-Based Power DevicesDevelopment of Advanced Polishing ConsumablesAdoption of Sic Wafers in Radio Frequency (RF) Devices
Restraints:
Surface Defects and ContaminationLong Polishing Cycle TimesLimited Supplier Base
Opportunities:
Growing Investments in Sic R&DEmergence of New ApplicationsAdvancements in Polishing Technologies
Challenges:
Complexity Regarding ManufacturingIntense Competition and Market Consolidation
Companies Mentioned:
3MAce Nanochem Co., Ltd.Advanced Abrasives CorporationAGC Inc.Allied High Tech ProductsDuPont IncorporatedEngis CorporationEntegrisFerro CorporationFujibo Holdings, Inc.Fujifilm Holdings America CorporationFujimi IncorporatedIljin Diamond Co., Ltd.JSR CorporationKemet International LimitedLapmaster WoltersLogitech Ltd.Nitta DuPont IncorporatedPureonSaint-GobainShanghai Xinanna Electronic Technology Co., LtdSKC
For more information about this report visit https://www.researchandmarkets.com/r/j05lqp
About ResearchAndMarkets.com
ResearchAndMarkets.com is the world’s leading source for international market research reports and market data. We provide you with the latest data on international and regional markets, key industries, the top companies, new products and the latest trends.
Media Contact:
Research and Markets
Laura Wood, Senior Manager
press@researchandmarkets.com
For E.S.T Office Hours Call +1-917-300-0470
For U.S./CAN Toll Free Call +1-800-526-8630
For GMT Office Hours Call +353-1-416-8900
U.S. Fax: 646-607-1907
Fax (outside U.S.): +353-1-481-1716
Logo: https://mma.prnewswire.com/media/539438/Research_and_Markets_Logo.jpg
View original content:https://www.prnewswire.com/news-releases/asia-pacific-emerges-as-epicenter-of-sic-wafer-polishing-market-growth-driven-by-robust-electronics-and-semiconductor-industry-301923266.html
SOURCE Research and Markets
